• Eight built-in SuperPro 7500s for higher programming speed and throughput rate
• Can program up to 32 chips simultaneously
• Automated flash programmer
• Suitable for high-density chips such as eMMC NAND /NOR FLASH and SPI FLASH with programming speed up to ten times faster than SuperBot-I
• Supports nearly 90, 000 IC devices from more than 300 manufactures. Device support is quick and will not be a bottleneck to the programming process
• High throughput, up to 2400 UPH
• Compact design, peripheral units include:

1. Standard and auto tray for material delivery
2. Braid packaging machine tape out
3. Tube for material delivery
4. Oil ink and laser marker
5. Tape and Tube

• Higher reliability, stability, and safety
• CE and RoHS Compliant

Expanded Features

• The largest device support in the industry
• Utilizes industrial personal computer (with control card inside).
• Built-in servo and vision system mode to quickly and accurately locate and complete chip capture, placement, programming and packaging automatically.
• Eight built-in internal SuperPro 7500 modules. Efficiency is much higher than parallel-production programmers because each module burns chips independently.

Advantages:

• • Modularizing system design capability.
  • Improved switching time.
  • High throughput (1600 devices per hour). 60x higher throughput rate than SuperBOT-I for eMMC, NAND/NOR Flash, and SPI Flash devices
  • Competitive quote.
  • Short change-over time. Automatic socket positioning and project loading with barcode scanning
  • Compact size
  • Remote control for project loading, quality monitoring, volume control, and file security
• Supports standard Tray & Tape Reel and Tube input & output for IC packages. Four pick-and-place nozzles, eight socket-pressing actuators, and two tape feeders
• Supports laser and ink marking

Motion

• Throughput Up to 1600 UPH (units per hour) handler index time with zero programming time for SuperBOT-I.
• Content High performance control card & servo drive system.
• Resolution X axis: (+/-)0.02mm; Y axis:(+/-) 0.02mm; Z axis: (+/-)0.02mm; ?axis: ±0.1°
• Max. stroke X axis: 1000 mm; Y axis: 500 mm; Z axis: 40mm.
• Pick & Place header accuracy (+/-) 0.07mm.
• Operable chip size: min: 2×2 mm; max: 25×25 mm

Vision System

• Two CCD Cameras Upward CCD for IC positioning while the downward CCD for sockets / pick-and-place spot positioning
• Camera 512×512 pixels
• Field of view 30mm x 300mm
• Vision accuracy ∆x=∆y=0.07 mm,∆Θ=0.1°

I/O Devices

Manual Tray: Manually change one tray each time (Standard equipped with purchase)
Tape-out Device: Heat sealing and pressure sealing modes. Tape width adjustable between 8 and 32mm.
Tape-In Device: YAMAHA pneumatic feeder. Tape width between 8 and 32mm applicable.
Auto Tray Device: Moves blank tray in and passed tray out the machine automatically, marking the tray (optional). Stack up to 15 JEDEC trays.
Tube-In Device: Moves chips in the machine. Use chip guider for different chip width (optional).
Tube-Out Device: Moves chips out the machine.Use chip guider for different chip width (optional).
Tape Ink-Marker: An attachment to the tape-out device. Marks an ink dot on the chip.
Auto Tray Ink-Marker: An attachment to the auto tray device. Scan and put dots on the passed chips.
Laser-Marker: An optional attachment to the tape-out or the auto tray device. Marks up to 4 characters on the passed chips.

Assisted Control

• Built-in Control : PC-based control with Windows XP.
• Display : LCD monitor.
• Data entry : Keyboard & mouse